| PART |
Description |
Maker |
| M6MGT641S8BKT M6MGB641S8BKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
| IS457 |
High Speed Response Type OPIC Light Detector
|
Sharp Corporation
SHARP[Sharp Electrionic Components]
|
| BUXXTA2WHFV BUXXTA2WNVX BU18TA2WNVX-TR BU29TA2WHFV |
High-speed Load Response FULL CMOS LDO Regulators
|
Rohm
|
| PC410 |
Compact, Surface Mount Ultra-high Speed Response OPIC Photocoupler
|
Sharp Electrionic Components
|
| P3257-50 |
Allowable current:40mA; MCT photoconductive detector: dewar type detector with high sensitivity and high-speed response in long wavelength range
|
Hamamatsu Corporation
|
| S9703-01 S9703 |
Photo IC for laser beam synchronous detection High sensitivity, high-speed response
|
Hamamatsu Corporation
|
| EL5185CS-T7 EL5185 EL5185CS EL5185CS-T13 |
4ns High-Speed Comparator COMPARATOR, 4000 uV OFFSET-MAX, 4 ns RESPONSE TIME, PDSO8
|
Intersil, Corp.
INTERSIL[Intersil Corporation]
|
| ISL55142IVZ ISL55141IVZ |
High-Speed 18V CMOS Comparators; Temperature Range: -40°C to 85°C; Package: 20-TSSOP COMPARATOR, 50000 uV OFFSET-MAX, 9.5 ns RESPONSE TIME, PDSO20
High-Speed 18V CMOS Comparators; Temperature Range: -40°C to 85°C; Package: 14-TSSOP COMPARATOR, 50000 uV OFFSET-MAX, 9.5 ns RESPONSE TIME, PDSO14
|
Intersil, Corp.
|
| HCPL-901J HCPL-900J HCPL-9031 HCPL-902J HCPL-9030 |
SPECIAL
HCPL-0931 · High Speed Digital Isolator
HCPL-0930 · High Speed Digital Isolator
HCPL-092J · High Speed Digital Isolator
HCPL-091J · High Speed Digital Isolator
HCPL-090J · High Speed Digital Isolator
HCPL-0900 · High Speed Digital Isolator
HCPL-9000 · High Speed Digital Isolator
HCPL-9030 · High Speed Digital Isolator
HCPL-902J · High Speed Digital Isolator
HCPL-9031 · High Speed Digital Isolator
HCPL-900J · High Speed Digital Isolator
HCPL-901J · High Speed Digital Isolator
|
Agilent (Hewlett-Packard)
|
| S71WS-N S71WS512NB0BFWYP3 S71WS512NB0BAWAP3 S71WS5 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
|
| AM50DLI28BG AM50DL128BG |
Am50DL128BG - Stacked Multi-Chip Package (MCP) Flash Memory and SRAM Am50DL128BG -堆叠式多芯片封装（MCP）闪存和SRAM
|
Advanced Micro Devices, Inc.
Spansion, Inc.
|
| F4655-13 |
MCP ASSEMBLY FOR HIGH RESOLUTION TOF-MS
|
Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
|
